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Laser-Soldering Fundamentals There are relatively few variables associated with the laser in its application to soldering This is one of the advantages for laser processing Beam wavelength, irradiation time, and beam power are important to the process, as are the properties of the materials being joined Reflectivity, thermal conductivity, and laser damage threshold must be understood before soldering is attempted The wavelength will be fixed by the laser of choice, and the shorter the wavelength, the smaller the theoretical spot size, as discussed Generally, the reflectivity of a metal is lower at shorter wavelengths, thus a metal is more easily heated by an Nd:YAG laser than with a CO2 laser The converse is true for many polymeric materials, which are more absorptive at longer wavelengths and therefore more prone to damage with increasing wavelength Many polymeric materials are also absorptive at the UV end of the spectrum.

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A carbon dioxide laser beam is more likely to impart damage to a circuit board than the beam of an Nd:YAG laser, but either laser can inflict damage if the energy density is high enough In fact, either laser can easily cut through a component lead or drill through a circuit board if parameters are not adjusted properly The reflectivity of metals varies widely with composition and surface condition Every metal can be heated with a laser as long as the energy density of the beam and dwell time are sufficient for heating This is also the case with laser-irradiated component leads, board pads, and solder during the laser bonding process Measurements of the reflectivity of Sn-Pb solder show that a eutectic alloy can be as high as 74 percent at 106 (m or as low as 21 percent at 106 mm.

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A C#/.net-library for encoding and decoding DataMatrix codes (based on a .net- port of libdmtx). DataMatrix . net also contains a small application for generating ...

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6 Jan 2018 ... A C#/. net -library for encoding and decoding DataMatrix codes (based on a . net - port of libdmtx). DataMatrix . net also contains a small application ...

Therefore, in the case of the CO2 laser at 106mm on a Sn or Sn-Pb-plated lead and solder-coated pad, much energy will have to be directed at the metals to start the absorption process, since so little laser energy is absorbed by the solder and converted to heat; the rest of the energy is lost to reflectionThe reflected or multiply reflected beam may impinge on adjacent components and damage package bodies or even the circuit board itself, causing charring Therefore, Nd:YAG is preferable for circuit board soldering..

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MEMS are used in a variety of applications such as devices to deploy automobile airbags, video projection via a million individually steerable mirrors, microoptical systems for fibre-optic communications, super-fast electrophoresis systems for DNA separation, microrobots, microtweezers and neural probes Basically, the application of MEMS can be found in a few areas such as the automotive industry, aerospace industry, health-care industry, industrial products, consumer product industry and telecommunications industry Examples of MEMS devices or components produced in recent years include microgears, micromotors, microturbines and microoptical components Figure 818 shows a gear that is smaller than an ant s head with a pitch of the order of 100 m The micromotor shown in Figure 819 consists of a rotor, a stator and the torque transmission gear Both the microgear and micromotor are produced by the LIGA process which will be introduced later Microturbines such as the ones shown in Figure 820 are used to generate power The maximum rotational speed reaches 150,000

Generally, the laser beam is directed at the component lead to accomplish soldering, but when the lead material is highly reflective, as would be the case with a gold-plated finish, heating is slow and irradiation times impractically long. An alternative has been demonstrated whereby the beam is directed at solder-coated circuit board bonding pad. If there is leeway in design, the bonding pad can be extended to aid in this method, dubbed throughpad bonding (see Fig. 47.33b). In contrast to the usual beam impingement on the component lead, or through-lead bonding (see Fig. 47.33a), the beam is directed at the more absorptive solder or on the circuit board land, increasing process efficiency and locally melting the solder in the vicinity of beam impingement. Since the molten solder is in intimate contact FIGURE 47.33 Laser soldering: (a) through-lead laser soldering; (b) through-pad laser soldering (B). with the lead and pad, the heat from the bonding process is efficiently transferred. The process can result in rapid soldering along the entire length of the component lead and circuit board pad with rich solder fillets evident if the process is conducted properly.

Single-Point Laser Soldering This method requires a laser beam that is smaller in diameter than the length or width of the component lead or bonding pad. The beam is stepped to each lead-pad combination and delivered with sufficient energy to result in solder reflow. The beam can be CW, pulsed, or

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24 Nov 2013 ... See project site for more info - this is a packaging of the binaries hosted at Michael Faschinger's SourceForge site. * decode DataMatrix codes ...

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