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multiply pulsed to accomplish soldering as long as there is enough radiation delivered to cause the solder to undergo the phase change required for soldering and wetting. Due to the small beam diameter, as required by this technique for fine-pitch components, the energy density can be exceptionally high. In fact, it can be so high that if the lead is not in good contact with the bonding pad, then the laser s beam can damage the lead, perhaps cutting through it rather than soldering it. Overly intense irradiation can also cause a bonding pad to delaminate from the PWB. In any laser soldering technique where very small spot size is required, the beam diameter must be precisely controlled. A small variation in beam diameter, either through change in laser parameters or in working distance (focus), can dramatically affect the delivered energy density. In the cases of a 10 W Nd:YAG laser beam focused to a spot of 0.1 mm (0.004 in.) and a spot of 0.2 mm (0.008 in.), this seemingly small change in spot size will result in a large change in power density (see Eq. 47.2). P = p/d where P = power density p = average power d = focused beam diameter. (47.2)

For this example, the power density would vary from 1,273 W/mm2 for the 0.1 mm diameter beam to 318 W/mm2 for the 0.2 mm beam diameter, a fourfold reduction emphasizing the criticality of strict maintenance and process control when working with a small spot size. In most cases, a Gaussian distribution of the beam s energy distribution across the focused diameter is assumed. It is customary to measure the beam at the 1/e2 point (13.5 percent of the peak height), so, in fact, the beam is impinging on a slightly larger area. However, the most intense portion of the laser s beam is confined to the region bounded by the 1/e2 points in two dimensions, as shown in Fig. 47.34.

The output of an 8-bit DAC is Vout = Vref (input/256) where input is an 8-bit number and Vref is the reference voltage for the channel.

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Fig 818: A comparison of the size of a microgear Fig 819: A micromotor with a 700 m rotor [6, 10]

FIGURE 47.34 Laser energy density is measured from points on the distribution curve where the beam s intensity is 1/e2 (13.5 percent) of peak intensity or between points A1 and A2 in this plot.

Single-point laser bonding has been applied to soldering tape automated bonding (TAB) lead frames to silicon die, TAB leads to PWB, or multichip modules as well as for soldering gull-wing leaded components to circuit boards. This technique is not suited for bonding areaarray devices such as BGAs or CBGAs to PWBs.14

Dielectric minimum thickness typical of microsection thickness measurements (class D)

Dielectric maximum thickness typical of mechanical thickness measurements (classes A, B, C)

with that of an ant [4]

Overall thickness typical of mechanical thickness measurement (classes K, L, M)

FIGURE 6.5 Dielectric minimum thickness measurements by microsection. (from IPC-4101)

The MAX521 uses a simple two-wire interface. Up to four MAX521s can be connected to one set of these two-wire interfaces. This means that a host system with two output lines can be used to program up to 32 DACs! To send commands and data to MAX521, the host sends logic sequences on the SDA and SCL lines. Otherwise, these lines are held to 1 . The two-wire interface of MAX521 is compatible with the I2C interface. To maintain compatibility with I2C, external pull-up resistors on the SDA and SCL lines would be required. Otherwise, these resistors are not required. MAX521 is a receive-only device, so it cannot transmit any data. The host only needs two output signal lines for SDA and SCL signals. The SCL clock frequency is limited to 400 kHz. The host starts communication by first sending the address of the device followed by the rest of the information, which could be a command byte or a command byte

TABLE 6.6 Pit and Dent Point Values from IPC-4101 Longest Dimension, mm [in.] 0.13 0.25 mm [0.005 to 0.009] 0.26 0.50 mm [0.009 to 0.019] 0.51 0.75 mm [0.019 to 0.029] 0.76 1.00 mm [0.029 to 0.039] >1.00 mm [0.039] Point Value 1 2 4 7 30

TABLE 6.7 Surface Quality Grades from IPC-4101 Surface Quality Class Class A Class B Class C Class D Maximum Point Count 29 17 5 0 Other Requirements

revolutions per minute with a lifetime up to 100 million rotations [5] In addition, microoptical components are used for high-speed signal transmission in the telecommunication industry Figure 821 shows an array of microlenses made from a transparent polymer for endoscopy applications

As agreed between user and supplier (AABUS)

An example of a prepreg identification in IPC-4101 is:

P Material Designator 25 Specification Sheet E7628 Reinforcement Style Number TW Resin Content Method RE Flow Parameter Method VC Optional Prepreg Method

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