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FIGURE 47.35 For laser soldering to be effective, it is necessary to have lead-to-pad, pad-to-pad, and lead-to-pad coplanarity: (a) noncoplanar component leads on constant-volume (coplanar) solder pads; (b)a coplanar lead array on noncoplanar PWB solder lands.

The STOP condition is signaled by a low to high transition on the SDA signal line when the SCL signal is held high The address and command bytes transfer important information to MAX521 The address byte is needed to select one out of a maximum of four devices that could be connected to the SDA-SCL signal lines After the host starts the communication with the START condition, all the slave devices on the bus (here the bus is referred to the SDA and SCL signal lines) start listening The first information byte is the address byte The slave devices compare the address bits AD0 and AD1 with the AD0 and AD1 pins condition on the IC In case a match occurs, the subsequent transmission is for that slave device The next transmission is either a command byte or a command-byte, data-byte pair.

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surface-mount packages is the body-push method (see Fig. 47.36), in which a force is applied to the component body, springing the leads just slightly.As the solder melts below the lead, the lead drops down to board level, where it is frozen in the cooling solder. It is necessary to control the amount of push such that the solder joint is not stressed by a lead frozen in compression. This is particularly the case for coarse-pitched component leads, where much force may be required to overcome a coplanarity problem. When board pads and component leads are reasonably coplanar, then this method is adequate for high-yield, high-reliability soldering as long as the noncoplanarity is in a negative direction, as indicated in Fig. 47.36a.

Microelectro-mechanical Systems (MEMS)

FIGURE 47.36 The body-push method would be effective in (a), where a lead is below the level of adjoining leads. In the case of (b), too much force would be needed to push the component body down to make the high component lead coplanar with adjacent leads.This could result in too much stress in the solidified solder joints.

A compliant hold-down method has been reported that is inexpensive to fabricate and easy to implement.This consists of a silicone rubber foot and an aperture that allows the beam unobstructed access to the lead-pad combination. This method has been proven effective for TAB as well as for rigid leaded surface-mount device bonding. It obviates the problems associated with transparent hold-down methods in terms of flux build-up. The compliant foot holds leads to pads and can accommodate lead-to-pad noncoplanarity differences.

Flux for Laser Bonding Requirements are much the same as for other reflow methods. Flux must be active enough to remove oxides from the component lead, bonding pad, and the solder. Its optical characteristics in terms of reflection, absorption, and transmission must not interfere with the solder process. If too absorptive, the flux could char, becoming more absorptive, and then overheat and wreak damage to the underlying circuit board. Also, if denatured, it will lose its chemical effectiveness as a fluxing agent. In laser soldering, particularly in the scanned methods, the flux adds a path of heat transfer to the board and preheats the next joint to be soldered. In the absence of a liquid flux, the PWB is more likely to char if the laser impingement is not stringently controlled. During soldering, the laser beam s output is quick and intense. The high energy of the process results in exceptionally high processing temperatures for very short durations. The high processing temperature aids in flux activation, making even the mildest of no-clean fluxes an effective soldering agent.

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